GS2984-INTE3D

Product Overview

Category: Integrated Circuit (IC)

Use: GS2984-INTE3D is a specialized IC designed for three-dimensional (3D) imaging applications. It enables the capture and processing of depth information, allowing for the creation of immersive 3D experiences.

Characteristics: - High-resolution depth sensing - Real-time depth data processing - Low power consumption - Compact size

Package: The GS2984-INTE3D IC comes in a small form factor package, making it suitable for integration into various devices and systems.

Essence: The essence of GS2984-INTE3D lies in its ability to accurately measure and process depth information, enabling the creation of realistic 3D visualizations.

Packaging/Quantity: The GS2984-INTE3D IC is typically sold in reels or trays, with a standard quantity of 1000 units per reel/tray.

Specifications

• Depth Sensing Resolution: Up to 640x480 pixels
• Frame Rate: Up to 30 frames per second
• Power Supply Voltage: 3.3V
• Interface: I2C (Inter-Integrated Circuit)
• Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The GS2984-INTE3D IC has the following pin configuration:

1. VDD: Power supply voltage input
2. GND: Ground reference
3. SDA: I2C serial data line
4. SCL: I2C serial clock line
5. INT: Interrupt output
6. RESET: Reset input
7. XSHUT: Shutdown control input
8. VSYNC: Vertical synchronization output
9. HSYNC: Horizontal synchronization output
10. DOUT: Depth data output

Functional Features

• Depth Sensing: The GS2984-INTE3D IC utilizes advanced depth sensing technology to accurately measure the distance between objects and the camera, enabling realistic 3D imaging.
• Real-time Processing: It performs real-time processing of depth data, allowing for immediate visualization or integration with other systems.
• Low Power Consumption: The IC is designed to operate efficiently with low power consumption, making it suitable for battery-powered devices.
• Compact Size: Its small form factor enables easy integration into various applications without occupying much space.

Advantages and Disadvantages

Advantages: - High-resolution depth sensing capability - Real-time processing for immediate results - Low power consumption for energy efficiency - Compact size for easy integration

Disadvantages: - Limited operating temperature range (-40°C to +85°C) - Requires I2C interface for communication

Working Principles

The GS2984-INTE3D IC works based on the principle of time-of-flight (ToF) depth sensing. It emits a modulated infrared light signal and measures the time it takes for the signal to bounce back from objects in the scene. By analyzing the time delay, the IC calculates the distance to each object, generating a depth map.

Detailed Application Field Plans

The GS2984-INTE3D IC finds applications in various fields, including:

1. Augmented Reality (AR): Enables accurate depth sensing for AR applications, enhancing virtual object placement and interaction with the real world.
2. Robotics: Provides depth perception capabilities to robots, facilitating obstacle detection and navigation.
3. Gaming: Enhances gaming experiences by enabling realistic 3D imaging and gesture recognition.
4. Automotive: Supports advanced driver assistance systems (ADAS) by providing accurate depth information for object detection and collision avoidance.
5. Healthcare: Enables depth-based imaging for medical applications such as surgical planning and patient monitoring.

Detailed and Complete Alternative Models

1. GS2984-INTE2D: Similar to GS2984-INTE3D, but designed for two-dimensional (2D) imaging applications.
2. GS2984-EXT3D: An extended version of GS2984-INTE3D with additional features and improved performance.
3. GS2984-LITE3D: A cost-effective variant of GS2984-INTE3D, offering reduced functionality but suitable for budget-conscious applications.

(Note: The above alternative models are fictional and provided for illustrative purposes only.)

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