MAX6665ASA65+T

Product Overview

• Category: Integrated Circuit
• Use: Temperature Sensor
• Characteristics: High accuracy, small form factor, low power consumption
• Package: 8-pin SOIC
• Essence: Precision temperature measurement and monitoring
• Packaging/Quantity: Tape & Reel, 2500 units per reel

Specifications

• Temperature Range: -40°C to +125°C
• Accuracy: ±1.5°C (max) from -20°C to +85°C
• Supply Voltage: 2.7V to 5.5V
• Current Consumption: 45µA (typ)

Detailed Pin Configuration

1. GND
2. VCC
3. ALERT
4. SCL
5. SDA
6. NC
7. GND
8. TEMP

Functional Features

• Digital output
• Two-wire serial interface
• Programmable hysteresis
• Shutdown mode for power savings
• Small form factor

Advantages and Disadvantages

Advantages

• High accuracy over a wide temperature range
• Low power consumption
• Small package size
• Simple two-wire interface

Disadvantages

• Limited temperature range compared to some alternatives
• Requires external pull-up resistors for I2C communication

Working Principles

The MAX6665ASA65+T is a digital temperature sensor that uses an on-chip bandgap temperature sensor and sigma-delta analog-to-digital converter to accurately measure temperature. The digital output can be read via a two-wire serial interface.

Detailed Application Field Plans

The MAX6665ASA65+T is suitable for various applications requiring precise temperature monitoring, such as: - Industrial control systems - Automotive electronics - Consumer electronics - Medical devices - HVAC systems

Detailed and Complete Alternative Models

Some alternative models to the MAX6665ASA65+T include: - TMP117: High-accuracy digital temperature sensor with I2C interface - LM75: Digital temperature sensor with programmable temperature limits - DS18B20: Programmable resolution digital temperature sensor with 1-Wire interface

This completes the English editing encyclopedia entry structure for MAX6665ASA65+T, covering its product details, specifications, pin configuration, functional features, advantages and disadvantages, working principles, application field plans, and alternative models.