MX30UF4G18AB-TI

Product Overview

• Category: Integrated Circuit (IC)
• Use: Memory module for electronic devices
• Characteristics: High-speed, high-density, non-volatile memory
• Package: Small outline integrated circuit (SOIC)
• Essence: Stores and retrieves digital information in electronic devices
• Packaging/Quantity: Individually packaged, typically sold in reels of 1000 units

Specifications

• Memory Type: Flash memory
• Capacity: 4 gigabits (4 Gb)
• Organization: 512 megabytes x 8 bits
• Interface: Serial Peripheral Interface (SPI)
• Operating Voltage: 2.7V - 3.6V
• Operating Temperature: -40°C to +85°C
• Data Retention: Up to 20 years
• Programming Time: Typically less than 10ms per byte
• Erase Time: Typically less than 1s per sector

Detailed Pin Configuration

The MX30UF4G18AB-TI IC has the following pin configuration:

1. VCC: Power supply voltage
2. GND: Ground reference
3. HOLD: Suspends ongoing data transfer
4. WP: Write protect input
5. SCK: Serial clock input
6. SI: Serial data input
7. SO: Serial data output
8. CS: Chip select input

Functional Features

• High-speed data transfer with SPI interface
• Non-volatile memory retains data even when power is disconnected
• Low power consumption during standby mode
• Sector-based erasing and byte-level programming
• Hardware write protection feature
• Wide operating temperature range for various applications

Advantages and Disadvantages

Advantages

• Compact size and lightweight
• High storage capacity
• Fast data transfer rate
• Low power consumption
• Long data retention period
• Easy integration into electronic devices

Disadvantages

• Limited erase and write cycles
• Relatively higher cost compared to other memory technologies
• Susceptible to electromagnetic interference

Working Principles

The MX30UF4G18AB-TI utilizes flash memory technology to store digital information. It consists of a grid of memory cells, where each cell can store multiple bits of data. The memory cells are organized in sectors, which can be individually erased or programmed.

During operation, the IC communicates with the host device through the SPI interface. Data is transferred serially between the IC and the host, allowing for high-speed communication. The IC also incorporates hardware write protection features to prevent accidental modification of stored data.

Detailed Application Field Plans

The MX30UF4G18AB-TI is widely used in various electronic devices that require non-volatile memory storage. Some common application fields include:

1. Consumer Electronics: Smartphones, tablets, digital cameras, portable media players
2. Automotive: Infotainment systems, navigation systems, instrument clusters
3. Industrial: Embedded systems, control units, data loggers
4. Networking: Routers, switches, network storage devices
5. Medical: Patient monitoring devices, medical imaging equipment

Detailed and Complete Alternative Models

• MX25R6435F: 64 megabits (Mb) NOR Flash memory
• MX66U51235F: 512 megabits (Mb) NAND Flash memory
• MX25L12845E: 128 megabits (Mb) Serial Flash memory
• MX23C1610MC: 16 megabits (Mb) Mask ROM

These alternative models offer different capacities, interfaces, and characteristics to suit specific application requirements.

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