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HTZ260G16K
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HTZ260G16K Product Overview

Introduction

The HTZ260G16K is a high-performance electronic component designed for use in various applications. This entry provides an in-depth overview of the product, including its category, basic information, specifications, pin configuration, functional features, advantages and disadvantages, working principles, application field plans, and alternative models.

Product Category and Use

The HTZ260G16K belongs to the category of integrated circuits and is primarily used as a memory module in electronic devices. It is commonly utilized in computer systems, servers, and other electronic equipment that require high-speed and reliable memory solutions.

Characteristics

  • Speed: The HTZ260G16K offers high-speed data transfer capabilities, making it suitable for demanding applications.
  • Capacity: With a large storage capacity, this memory module can accommodate extensive data requirements.
  • Reliability: The product is known for its reliability and stability, ensuring consistent performance in diverse operating conditions.

Package and Quantity

The HTZ260G16K is typically packaged in anti-static bags or trays to prevent electrostatic discharge. It is available in various quantities to cater to different production and project needs.

Specifications

  • Type: DDR4 SDRAM
  • Capacity: 16GB
  • Speed: 2600MHz
  • Voltage: 1.2V
  • Form Factor: DIMM 288-pin
  • CAS Latency: CL16

Detailed Pin Configuration

The detailed pin configuration of the HTZ260G16K includes 288 pins arranged in a specific layout to facilitate seamless integration with compatible memory slots and interfaces.

Functional Features

  • High-Speed Data Transfer: The HTZ260G16K enables rapid data transfer, enhancing overall system performance.
  • Low Power Consumption: It is designed to operate efficiently while consuming minimal power, contributing to energy savings.
  • Error Correction: The memory module incorporates error correction features to maintain data integrity.

Advantages and Disadvantages

Advantages

  • High-speed performance
  • Large capacity
  • Reliable operation
  • Low power consumption

Disadvantages

  • Higher cost compared to lower capacity modules
  • Compatibility limitations with older systems

Working Principles

The HTZ260G16K operates based on DDR4 SDRAM technology, utilizing advanced memory management techniques to store and retrieve data efficiently. It synchronizes with the system's clock speed to ensure seamless data processing.

Detailed Application Field Plans

The HTZ260G16K is well-suited for a wide range of applications, including: - High-performance computing - Data centers and server environments - Gaming systems and graphic-intensive applications - Industrial automation and control systems

Detailed and Complete Alternative Models

Several alternative models offer similar functionality and compatibility with varying specifications, such as: - HTZ240G16K (DDR4, 16GB, 2400MHz) - HTZ320G16K (DDR4, 16GB, 3200MHz) - HTZ480G32K (DDR4, 32GB, 4800MHz)

In conclusion, the HTZ260G16K stands as a reliable and high-performance memory module catering to diverse electronic applications, offering exceptional speed, capacity, and reliability.

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Lista 10 Vanliga frågor och svar relaterade till tillämpningen av HTZ260G16K i tekniska lösningar

  1. What is HTZ260G16K?

    • HTZ260G16K is a high-performance, high-temperature resistant ceramic material commonly used in technical solutions for its excellent thermal and electrical properties.

  2. What are the key properties of HTZ260G16K?

    • HTZ260G16K exhibits high thermal conductivity, excellent electrical insulation, and exceptional resistance to high temperatures, making it ideal for various technical applications.

  3. In what technical solutions is HTZ260G16K commonly used?

    • HTZ260G16K is frequently employed in applications such as power electronics, high-temperature sensors, heating elements, and other components requiring reliable performance under extreme conditions.

  4. How does HTZ260G16K perform in high-temperature environments?

    • HTZ260G16K demonstrates remarkable stability and reliability at elevated temperatures, making it suitable for use in environments where traditional materials may degrade or fail.

  5. Is HTZ260G16K compatible with standard manufacturing processes?

    • Yes, HTZ260G16K can be machined, shaped, and processed using standard manufacturing techniques, allowing for seamless integration into technical solutions.

  6. What are the considerations for designing with HTZ260G16K?

    • Designers should consider the material's thermal expansion characteristics, mechanical strength, and compatibility with other components when incorporating HTZ260G16K into technical solutions.

  7. Can HTZ260G16K be used in electronic applications?

    • Absolutely, HTZ260G16K's excellent electrical insulation properties make it well-suited for electronic applications, particularly in high-power and high-temperature environments.

  8. Does HTZ260G16K require special handling or storage?

    • While HTZ260G16K is robust, it should be handled with care to prevent damage. Proper storage in a clean, dry environment is recommended to maintain its properties.

  9. Are there any limitations to the use of HTZ260G16K in technical solutions?

    • While highly versatile, designers should be mindful of the material's specific thermal and mechanical limitations to ensure optimal performance in their applications.

  10. Where can HTZ260G16K be sourced for technical projects?

    • HTZ260G16K can be obtained from reputable suppliers specializing in advanced ceramics, ensuring access to high-quality material for technical solutions.