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IS43DR16640C-3DBI-TR

IS43DR16640C-3DBI-TR

Product Overview

Category

IS43DR16640C-3DBI-TR belongs to the category of dynamic random access memory (DRAM) products.

Use

This product is primarily used for high-speed data storage and retrieval in electronic devices such as computers, smartphones, tablets, and other digital devices.

Characteristics

  • High-speed operation: IS43DR16640C-3DBI-TR offers fast data access and transfer rates, making it suitable for applications that require quick processing.
  • Large storage capacity: With a capacity of [specify capacity], this DRAM module provides ample space for storing data.
  • Low power consumption: The product is designed to operate efficiently with minimal power consumption, contributing to energy savings.
  • Compact package: IS43DR16640C-3DBI-TR comes in a compact form factor, allowing for easy integration into various electronic devices.
  • Reliable performance: This DRAM module is known for its reliable performance and durability.

Package and Quantity

IS43DR16640C-3DBI-TR is typically packaged in a small outline integrated circuit (SOIC) package. The quantity per package may vary depending on the manufacturer's specifications.

Specifications

  • Memory type: Dynamic Random Access Memory (DRAM)
  • Capacity: [specify capacity]
  • Operating voltage: [specify voltage range]
  • Data transfer rate: [specify transfer rate]
  • Interface: [specify interface type]
  • Operating temperature range: [specify temperature range]

Pin Configuration

The detailed pin configuration of IS43DR16640C-3DBI-TR can be found in the datasheet provided by the manufacturer. It includes pins for power supply, address inputs, data inputs/outputs, control signals, and other necessary connections.

Functional Features

  • High-speed data access: IS43DR16640C-3DBI-TR offers fast read and write operations, enabling efficient data processing.
  • Refresh mechanism: The product incorporates a refresh mechanism to maintain the integrity of stored data over time.
  • Error correction: Some variants of IS43DR16640C-3DBI-TR may include error correction capabilities to ensure data accuracy.
  • Compatibility: This DRAM module is designed to be compatible with various electronic devices and systems.

Advantages

  • Fast data access and transfer rates enhance overall system performance.
  • Large storage capacity allows for storing a significant amount of data.
  • Low power consumption contributes to energy efficiency.
  • Compact package facilitates easy integration into different devices.
  • Reliable performance ensures data integrity and system stability.

Disadvantages

  • May require additional cooling mechanisms in high-performance applications due to heat generation.
  • Sensitive to electrical noise and voltage fluctuations, requiring proper signal conditioning.

Working Principles

IS43DR16640C-3DBI-TR operates based on the principles of dynamic random access memory. It utilizes capacitors to store charge representing binary data. The stored charge needs to be periodically refreshed to maintain data integrity.

Application Field Plans

IS43DR16640C-3DBI-TR finds application in various fields, including: - Personal computers and laptops - Servers and data centers - Mobile devices (smartphones, tablets) - Networking equipment - Automotive electronics - Industrial automation systems

Alternative Models

  • [Alternative Model 1]: [Brief description]
  • [Alternative Model 2]: [Brief description]
  • [Alternative Model 3]: [Brief description]

These alternative models offer similar functionality and can be considered as alternatives to IS43DR16640C-3DBI-TR depending on specific requirements.

In conclusion, IS43DR16640C-3DBI-TR is a high-speed, high-capacity DRAM module used in various electronic devices. Its compact package, reliable performance, and low power consumption make it a suitable choice for applications requiring fast data processing and storage.

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Lista 10 Vanliga frågor och svar relaterade till tillämpningen av IS43DR16640C-3DBI-TR i tekniska lösningar

Sure! Here are 10 common questions and answers related to the application of IS43DR16640C-3DBI-TR in technical solutions:

  1. Question: What is the IS43DR16640C-3DBI-TR?
    Answer: The IS43DR16640C-3DBI-TR is a specific model of DDR3 SDRAM memory chip.

  2. Question: What is the capacity of the IS43DR16640C-3DBI-TR?
    Answer: The IS43DR16640C-3DBI-TR has a capacity of 16 megabits (Mb) or 2 megabytes (MB).

  3. Question: What is the operating voltage range for the IS43DR16640C-3DBI-TR?
    Answer: The IS43DR16640C-3DBI-TR operates at a voltage range of 1.7V to 1.95V.

  4. Question: What is the maximum clock frequency supported by the IS43DR16640C-3DBI-TR?
    Answer: The IS43DR16640C-3DBI-TR supports a maximum clock frequency of 400 MHz.

  5. Question: What is the package type of the IS43DR16640C-3DBI-TR?
    Answer: The IS43DR16640C-3DBI-TR comes in a 96-ball BGA (Ball Grid Array) package.

  6. Question: What is the temperature range for the IS43DR16640C-3DBI-TR?
    Answer: The IS43DR16640C-3DBI-TR can operate within a temperature range of -40°C to +85°C.

  7. Question: Can the IS43DR16640C-3DBI-TR be used in automotive applications?
    Answer: Yes, the IS43DR16640C-3DBI-TR is AEC-Q100 qualified and suitable for automotive applications.

  8. Question: What are some typical applications of the IS43DR16640C-3DBI-TR?
    Answer: The IS43DR16640C-3DBI-TR is commonly used in networking equipment, industrial control systems, and automotive electronics.

  9. Question: Does the IS43DR16640C-3DBI-TR support burst read and write operations?
    Answer: Yes, the IS43DR16640C-3DBI-TR supports burst read and write operations for efficient data transfer.

  10. Question: Is the IS43DR16640C-3DBI-TR backward compatible with DDR2 memory?
    Answer: No, the IS43DR16640C-3DBI-TR is not backward compatible with DDR2 memory. It is specifically designed for DDR3 memory interfaces.

Please note that these answers are based on general information about the IS43DR16640C-3DBI-TR and may vary depending on specific technical requirements and datasheet specifications.