EPF10K130EFC672-3

Basic Information Overview

• Category: Programmable Logic Device (PLD)
• Use: EPF10K130EFC672-3 is a PLD used for digital logic applications.
• Characteristics:
  • High-density programmable logic device
  • Advanced CMOS technology
  • Low power consumption
  • Fast performance
• Package: The EPF10K130EFC672-3 comes in a 672-pin FineLine BGA package.
• Essence: EPF10K130EFC672-3 is designed to provide flexible and efficient digital logic implementation.
• Packaging/Quantity: The EPF10K130EFC672-3 is typically sold individually or in small quantities.

Specifications

• Logic Elements: 131,072
• Maximum User I/Os: 356
• Operating Voltage: 3.3V
• Speed Grade: -3
• Clock Frequency: Up to 250 MHz
• Embedded Memory: 1,152 Kbits
• Programmable Interconnect Points: 129,600
• JTAG Boundary Scan Support: Yes

Detailed Pin Configuration

The EPF10K130EFC672-3 has a total of 672 pins. These pins are assigned for various purposes such as input/output, power supply, configuration, and control signals. A detailed pin configuration diagram can be found in the datasheet provided by the manufacturer.

Functional Features

• High-density programmable logic elements allow for complex digital circuit implementation.
• Flexible interconnect structure enables efficient signal routing.
• Embedded memory blocks provide additional storage capacity.
• JTAG boundary scan support facilitates testing and debugging.

Advantages

• High logic density allows for the implementation of complex designs.
• Low power consumption makes it suitable for battery-powered applications.
• Fast performance enables real-time processing of digital signals.
• Flexible interconnect structure provides design flexibility.

Disadvantages

• Limited number of user I/Os may restrict the connectivity options for certain applications.
• FineLine BGA package may require specialized equipment for soldering and rework.
• Availability of alternative models with different features may limit the scalability of designs.

Working Principles

The EPF10K130EFC672-3 is based on advanced CMOS technology. It consists of programmable logic elements, memory blocks, and a flexible interconnect structure. The device can be programmed using a configuration file to implement desired digital logic functions. During operation, the inputs are processed through the programmable logic elements, and the outputs are generated based on the programmed logic equations.

Detailed Application Field Plans

The EPF10K130EFC672-3 can be used in various application fields, including: 1. Communications: Implementing digital signal processing algorithms, protocol handling, and data encryption. 2. Industrial Automation: Controlling and monitoring complex systems, such as robotics and manufacturing processes. 3. Automotive: Implementing control systems for engine management, driver assistance, and infotainment. 4. Aerospace: Designing flight control systems, avionics, and satellite communication systems. 5. Consumer Electronics: Developing high-performance audio/video processing, gaming consoles, and smart home devices.

Detailed and Complete Alternative Models

1. EPF10K50SFC256-2: A lower-density version with 50,000 logic elements and 256-pin package.
2. EPF10K200SFC484-3: A higher-density version with 200,000 logic elements and 484-pin package.
3. EPF10K20RC240-4: A low-cost version with 20,000 logic elements and 240-pin package.
4. EPF10K400CB672-3: A higher-performance version with 400,000 logic elements and 672-pin package.

These alternative models offer different combinations of logic density, I/O count, and package options to cater to various design requirements.

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