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3.6OEFMA80

3.6OEFMA80

Product Overview

Category

3.6OEFMA80 belongs to the category of electronic components.

Use

It is used as a power management integrated circuit (PMIC) in various electronic devices.

Characteristics

  • Efficient power management
  • Compact size
  • Wide operating temperature range
  • Low power consumption

Package

The product comes in a small, surface-mount package.

Essence

3.6OEFMA80 is essential for regulating and distributing power within electronic systems.

Packaging/Quantity

It is typically packaged in reels containing a specific quantity, such as 3000 units per reel.

Specifications

  • Input Voltage Range: 3V to 5.5V
  • Output Voltage: 0.8V
  • Maximum Output Current: 3.6A
  • Operating Temperature: -40°C to 85°C
  • Package Type: QFN

Detailed Pin Configuration

  1. VIN (Input Voltage)
  2. GND (Ground)
  3. EN (Enable)
  4. FB (Feedback)
  5. SW (Switch)
  6. VOUT (Output Voltage)

Functional Features

  • Integrated voltage regulator
  • Overcurrent protection
  • Thermal shutdown
  • Power good indicator

Advantages

  • High efficiency
  • Small form factor
  • Robust protection features
  • Reliable performance across temperature variations

Disadvantages

  • Limited maximum output current
  • Sensitive to voltage spikes

Working Principles

3.6OEFMA80 operates by regulating the input voltage to provide a stable output voltage for powering electronic components. It utilizes internal control circuitry to monitor and adjust the output based on the input and load conditions.

Detailed Application Field Plans

This PMIC is commonly used in portable electronic devices, IoT modules, and battery-powered systems where efficient power management is crucial. It is suitable for applications requiring compact and reliable power regulation.

Detailed and Complete Alternative Models

  • 3.3OEFMA75
  • 4.2OEFMA90
  • 2.5OEFMA65

In conclusion, 3.6OEFMA80 is a versatile power management IC with efficient characteristics and robust functionality, making it an ideal choice for various electronic applications.

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Lista 10 Vanliga frågor och svar relaterade till tillämpningen av 3.6OEFMA80 i tekniska lösningar

  1. What is 3.6OEFMA80?

    • 3.6OEFMA80 is a type of epoxy adhesive commonly used in technical solutions for bonding various materials.
  2. What are the key properties of 3.6OEFMA80?

    • 3.6OEFMA80 exhibits high strength, excellent chemical resistance, and good thermal stability, making it suitable for demanding technical applications.
  3. Can 3.6OEFMA80 be used for bonding metals?

    • Yes, 3.6OEFMA80 is designed to bond metals effectively, providing strong and durable adhesion.
  4. Is 3.6OEFMA80 suitable for outdoor applications?

    • Yes, 3.6OEFMA80 is formulated to withstand outdoor conditions, including exposure to UV radiation and varying temperatures.
  5. What surface preparation is required before using 3.6OEFMA80?

    • It is recommended to clean and degrease the surfaces to be bonded before applying 3.6OEFMA80 for optimal adhesion.
  6. Does 3.6OEFMA80 require special curing conditions?

    • 3.6OEFMA80 typically cures at room temperature, but for specific applications, elevated temperatures may be used to accelerate the curing process.
  7. Can 3.6OEFMA80 be used for bonding plastics?

    • Yes, 3.6OEFMA80 is suitable for bonding various types of plastics, providing a strong and reliable bond.
  8. What is the shelf life of 3.6OEFMA80?

    • The shelf life of 3.6OEFMA80 is typically around 12 months when stored in its original, unopened containers at recommended temperatures.
  9. Is 3.6OEFMA80 resistant to chemicals and solvents?

    • Yes, 3.6OEFMA80 demonstrates good resistance to a wide range of chemicals and solvents, making it suitable for applications where exposure to these substances is expected.
  10. Can 3.6OEFMA80 be used for structural bonding?

    • Yes, 3.6OEFMA80 is often used for structural bonding applications due to its high strength and durability. However, it's important to follow the manufacturer's guidelines for specific structural bonding requirements.