AS7C316096C-10BIN

Product Overview

Category: Integrated Circuit (IC)

Use: Memory chip

Characteristics: - High-speed CMOS static random access memory (SRAM) - Low power consumption - 16 Megabit (1M x 16-bit) organization - 10ns access time - Industrial temperature range (-40°C to +85°C) - RoHS compliant

Package: BGA (Ball Grid Array)

Essence: The AS7C316096C-10BIN is a high-performance SRAM chip designed for various applications that require fast and reliable data storage.

Packaging/Quantity: The AS7C316096C-10BIN is typically packaged in trays or reels, with a quantity of 250 units per tray/reel.

Specifications

• Organization: 1M x 16 bits
• Access Time: 10ns
• Voltage Supply: 3.0V - 3.6V
• Standby Current: 5μA (typical)
• Operating Temperature Range: -40°C to +85°C
• Package Type: 48-ball FBGA

Pin Configuration

The AS7C316096C-10BIN has a total of 48 pins arranged in a Ball Grid Array (BGA) package. The pin configuration is as follows:

```

Pin Name Description

1 VDD Power Supply 2 A0 Address Input 3 A1 Address Input 4 A2 Address Input ... ... ... 46 DQ15 Data Input/Output 47 VSS Ground 48 NC No Connection ```

Functional Features

• High-speed operation: The AS7C316096C-10BIN offers a fast access time of 10ns, making it suitable for applications that require quick data retrieval.
• Low power consumption: This memory chip is designed to minimize power consumption, making it ideal for battery-powered devices or energy-efficient systems.
• Reliable data storage: The SRAM technology used in this chip ensures reliable data retention and high-speed read/write operations.
• Wide temperature range: With an operating temperature range of -40°C to +85°C, the AS7C316096C-10BIN can be used in various industrial environments.

Advantages and Disadvantages

Advantages: - High-speed operation - Low power consumption - Reliable data storage - Wide temperature range

Disadvantages: - Limited storage capacity (16 Megabit)

Working Principles

The AS7C316096C-10BIN is based on CMOS technology, which allows for high-speed operation and low power consumption. It utilizes static random access memory (SRAM) cells to store and retrieve data. When an address is provided, the chip activates the corresponding memory cell and reads or writes the data stored in it.

Detailed Application Field Plans

The AS7C316096C-10BIN can be used in various applications, including but not limited to: 1. Computer systems 2. Networking equipment 3. Telecommunications devices 4. Industrial control systems 5. Automotive electronics 6. Medical equipment 7. Consumer electronics

Detailed and Complete Alternative Models

1. AS7C316096C-10BGIN: Similar to AS7C316096C-10BIN, but with a different package type (48-ball TFBGA).
2. AS7C316096C-10BINR: Same as AS7C316096C-10BIN, but offered in tape and reel packaging for automated assembly.
3. AS7C316096C-10BEN: Enhanced version with extended temperature range (-55°C to +125°C).

These alternative models provide similar functionality and performance, allowing customers to choose the most suitable option for their specific requirements.

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