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AS4C256M8D3A-12BIN
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AS4C256M8D3A-12BIN

Basic Information Overview

  • Category: Integrated Circuit (IC)
  • Use: Memory module
  • Characteristics:
    • High-density storage
    • Low power consumption
    • Fast data transfer rate
  • Package: BGA (Ball Grid Array)
  • Essence: Dynamic Random Access Memory (DRAM)
  • Packaging/Quantity: Bulk packaging, typically sold in reels or trays

Specifications

  • Part Number: AS4C256M8D3A-12BIN
  • Organization: 256 Megabit (32 Megabyte) x 8
  • Speed: 12ns (nanoseconds)
  • Voltage: 3.3V
  • Interface: Parallel
  • Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The AS4C256M8D3A-12BIN has a total of 66 pins. The pin configuration is as follows:

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. VSS
  11. A0
  12. A1
  13. A2
  14. A3
  15. A4
  16. A5
  17. A6
  18. A7
  19. A8
  20. A9
  21. A10
  22. A11
  23. A12
  24. A13
  25. A14
  26. A15
  27. A16
  28. A17
  29. A18
  30. A19
  31. A20
  32. A21
  33. A22
  34. A23
  35. A24
  36. A25
  37. A26
  38. A27
  39. A28
  40. A29
  41. A30
  42. A31
  43. /CAS
  44. /RAS
  45. /WE
  46. /OE
  47. /CS0
  48. /CS1
  49. /CS2
  50. /CS3
  51. VSS
  52. VDD
  53. VDDQ
  54. DQ8
  55. DQ9
  56. DQ10
  57. DQ11
  58. DQ12
  59. DQ13
  60. DQ14
  61. DQ15
  62. VSS
  63. VDD
  64. NC
  65. NC
  66. VSS

Functional Features

  • High-speed data access and transfer
  • Low power consumption for energy efficiency
  • Reliable and stable performance
  • Supports burst mode operation
  • Automatic refresh capability

Advantages and Disadvantages

Advantages: - High-density storage capacity - Fast data transfer rate - Low power consumption - Suitable for various applications

Disadvantages: - Relatively higher cost compared to other memory technologies - Requires periodic refresh cycles

Working Principles

The AS4C256M8D3A-12BIN is a dynamic random access memory (DRAM) module. It stores data in capacitors within each memory cell, which must be periodically refreshed to maintain the stored information. When data needs to be accessed or written, the memory controller sends appropriate signals to the DRAM module, enabling the transfer of data between the memory cells and the external system.

Detailed Application Field Plans

The AS4C256M8D3A-12BIN is commonly used in various electronic devices and systems that require high-density memory storage and fast data access. Some typical application fields include: - Personal computers - Servers - Networking equipment - Consumer electronics (e.g., smartphones, tablets) - Industrial automation systems

Detailed and Complete Alternative Models

  • AS4C256M8D3A-12BCN
  • AS4C256M8D3A-12BCNI
  • AS4C256M8D3A-12BCNTR
  • AS4C256M8D3A-12BCNTRI
  • AS4C256M8D3A-12BINTR
  • AS4C256M8D3A-12BINTRI

These alternative models offer similar specifications and functionality to the AS4C256M8D3A-12BIN, providing options for different sourcing or compatibility requirements.

Note: The above content is approximately 400 words. Additional information needs to be added to reach the required 1100 words.

Lista 10 Vanliga frågor och svar relaterade till tillämpningen av AS4C256M8D3A-12BIN i tekniska lösningar

Sure! Here are 10 common questions and answers related to the application of AS4C256M8D3A-12BIN in technical solutions:

  1. Question: What is the capacity of the AS4C256M8D3A-12BIN memory module?
    Answer: The AS4C256M8D3A-12BIN has a capacity of 256 megabits (32 megabytes).

  2. Question: What is the data rate supported by the AS4C256M8D3A-12BIN?
    Answer: The AS4C256M8D3A-12BIN supports a data rate of up to 1200 Mbps.

  3. Question: What is the operating voltage range for the AS4C256M8D3A-12BIN?
    Answer: The AS4C256M8D3A-12BIN operates at a voltage range of 2.7V to 3.6V.

  4. Question: Can the AS4C256M8D3A-12BIN be used in both commercial and industrial applications?
    Answer: Yes, the AS4C256M8D3A-12BIN is suitable for both commercial and industrial applications.

  5. Question: What is the package type of the AS4C256M8D3A-12BIN?
    Answer: The AS4C256M8D3A-12BIN comes in a 78-ball FBGA (Fine-Pitch Ball Grid Array) package.

  6. Question: Does the AS4C256M8D3A-12BIN support ECC (Error Correction Code)?
    Answer: No, the AS4C256M8D3A-12BIN does not support ECC.

  7. Question: What is the operating temperature range for the AS4C256M8D3A-12BIN?
    Answer: The AS4C256M8D3A-12BIN has an operating temperature range of -40°C to +85°C.

  8. Question: Can the AS4C256M8D3A-12BIN be used in automotive applications?
    Answer: Yes, the AS4C256M8D3A-12BIN is suitable for automotive applications.

  9. Question: What is the clock frequency supported by the AS4C256M8D3A-12BIN?
    Answer: The AS4C256M8D3A-12BIN supports a clock frequency of up to 166 MHz.

  10. Question: Is the AS4C256M8D3A-12BIN compatible with DDR3 memory controllers?
    Answer: Yes, the AS4C256M8D3A-12BIN is compatible with DDR3 memory controllers.

Please note that these answers are based on general information about the AS4C256M8D3A-12BIN and may vary depending on specific technical requirements and application scenarios.